TECHSPRING PROJECT

FIRST YEAR PUBLISHABLE EXECUTIVE SUMMARY

The main aim of the Tech-Spring project is to develop a toolkit to enable European Spring Manufacturers to help their customers design novel lightweight springs. The toolkit will be comprehensive in supplying advice about the design of compression, extension, torsion springs made from wire and also springs made from strip. It will be integrated with an existing computer aided design package providing accurate quantification of maximum stresses to utilise without compromising performance or reliability.

The Tech-Spring project has just completed the first of three years. During this first year a number of case studies have been initiated to explore the limits of performance of a range of different types of springs.

A considerable program of testing is in progress addressing each of the above case study topics. A few of the case studies have been completed - for example case study e) the results of which will be presented at the only international conference on springs to be held in 2007. The way in which prestressing benefits are illustrated in a Goodman Diagram will be modified as a result of this work. This result will appear in the toolkit and will be presented in training programs given first to DSA and ANCCEM and then more widely in Europe. Each of the case studies will yield results and training opportunities during the second year of the Tech-Spring project. The toolkit will be completed in the third year.

Another aspect of the Tech-Spring project is the evaluation of advanced stress analysis methods. These will include:

The toolkit will identify the circumstances in which these analysis methods would be a cost effective investment for spring manufacturers.

The technical tasks of the project should be complete by the end of the second year of the project with dissemination of results, development of the toolkit and training being the focus of the third year.

For more information contact the project coordinator, Mark Hayes, m.hayes@ist.org.uk.